1

Max Layer Count

64 Layer

2

Max Board Size

650mm*1200mm

3

Board Thickness

2 Layer 0.2mm-6.0mm

4 Layer 0.4mm-10.0mm

6 Layer 0.8mm-10.0mm

8 Layer 1.0mm-10.0mm

10 Layer 1.2mm-10.0mm

12 Layer 1.5mm-10.0mm

14 Layer 1.5mm-10.0mm

16 Layer 1.6mm-10.0mm

18 Layer 2.2mm-10.0mm

20 Layer 2.4mm-10.0mm

4

Min Trace Width

0.05mm

5

Min Trace Space

0.05mm

6

Min Hole Size

Through Hole 0.15m
mLaser Via Hole 0.1mm

7

PTH Tolerance

+/-0.05mm

8

NPTH Tolerance

+/-0.05mm

9

Outline Tolerance

+/-0.1mm

10

Hole Position Tolerance

+/-0.05mm

11

Min Solder Mask Bridge

0.075mm

12

Hole Wall Copper Thickness

10um-50um

13

Copper Thickness

Inner Layer 0.5oz-5o

zOuter Layer 0.5oz-13oz

14

Surface Finish

HASL, OSP, Immersion Gold/Silver/Tin, Flash Gold, Golden Finger

15

Insulation Resistance

1*1012Ω

16

Aspect Ratio

13:1

17

Warp And Twist

≤0.5%

18

Impedance Control

+/-10%

19

Flame Retardant

94V-0

20

Material

FR4, High TG FR4, High Frequency Material, Aluminum

21

HDI

1+N+1、2+N+2、3+N+3、Other layer HDI